16/11/2010

3M Announces New 2 mm Pitch IDC Cable-to-Board Interconnect Solutions

3M's Ribbon Cable Sockets 158 Series platform is the only known product line in the industry to offer this combination of unique configurations:

* 30 µ" Au plating version with 3M's exclusive adhesive backed cover for robust termination, improved strain relief and discrete wire capability
* 30 µ" and 15µ" Au version with a pre-assembled cover and packaged on 3M's innovative "sword pack" to enable higher speed termination operations versus traditional separated cover termination methods
* Available friction latch configurations to offer increased protection against accidental disconnect
* Bulk packaged 15 µ" Au versions for high volume, cost-effective operations

Shrouded Boardmount Headers 159 Series are designed to maximize design flexibility while minimizing PCB footprint. They mate to Ribbon Cable Sockets 158 Series, and are available in the following configurations:

* 30 and 15 µ" Au versions
* Vertical mount, thru-hole and surface mount
* Right angle mount, thru-hole
* Extended shroud version available to mate to 3M brand Molded Cable Assemblies Series 87

"Ribbon Cable IDC interconnects are unsung heroes of the electronics industry and a fundamental building block in millions of electronic systems," said David Schneider, business manager for 3M's Electronic Solutions Division, Interconnect. "The 158 Series socket and 159 Series header products are the first in a series of solutions to reinvigorate this core technology, and provide the industry with a solid, comprehensive line of robust, sub .100" pitch cable-to-board solutions not currently offered in the market today."

Source: 3M