09/04/2026
Efficient HFFR cable compounds are central to enabling the generative AI revolution. By supporting the infrastructure for rapid, massive data transmission, they are also crucial for ensuring data centre safety, which is vital as data demands surge.
However - data transmission is a major bottleneck for AI deployment.
Since 2022, generative AI has transformed the digital landscape. Advances in chipsets have made large language models more effective, changing how we work and interact. While generative AI offers greater efficiency and new capabilities, it also presents challenges.
The increased computing power demands vast amounts of data for efficient model learning. Hyperscale data centres are expanding to support this need. While energy consumption and cooling are well-known concerns, data transmission limitations are becoming a critical challenge.
Indeed, to connect cabinets within the same data centre or across data centres, the actual technology based on current fibre-optic cables and connectors cannot keep pace with the exponential growth in data transmission that is driven by advanced computing power. To address this, higher-density cable and connector designs will be needed in the coming years. And by the end of the decade, connections per switch rack must double to over 30,000 while remaining compatible with existing conduits.
HFFR compounds are the solution for new fibre optic cable designs
Polymer needs to be used in order to meet the performance and fire safety measures: HFFR compounds can meet this concern, not simply because the European CPR requirements call for such a compound, but also to ensure that in case of fire ignition, the acidic smoke is a no-go, as it may compromise the electronic configurations. The other challenge is providing material that can meet the thin-layer requirements to minimise crosstalk between fibres. Benvic, based on its knowledge of HFFR compounds, can certainly meet these challenges and can also support the rise of fibre-optic cables for hyperscale data centres using HFS006, HFS007, and HFS614 grades. Our engineers can also optimise formulations for efficient performance and easy manufacturing.
Benvic is attending the Wire Expo in Düsseldorf next week - so let’s meet on stand H11/E59, and review our options for supporting this important new digital horizon.